ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,571, issued on June 30, was assigned to DENSO Corp. (Kariya, Japan). "Electronic device" was invented by Kenichiro Takagi (Nisshin-city, Ja... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,572, issued on June 30, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate with interconnects" was invented by Joan... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,573, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Flexible package" was invented by Wei... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,574, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bonding method" was invented by... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,575, issued on June 30, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method for arranging... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,576, issued on June 30, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Semiconductor structure and manufacturing method ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,577, issued on June 30, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device and manufac... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,578, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Cap layer for pad oxidation prevent... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,579, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,580, issued on June 30, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Method of manufacturing semiconductor package using double... और पढ़ें